ASTM D 5109 : 2012

Name: ASTM D 5109 : 2012
Brand: ASTM
Price: 122.77 AUD

Withdrawn

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

Available format(s)

Hardcopy , PDF

Withdrawn date

09-03-2020

Language(s)

English

Published date

01-11-2012

Publisher

American Society for Testing and Materials

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure	Section
Referenced Documents	2
Conditioning	4
Dielectric Breakdown Voltage Parallel to Laminations	13
Dimensional Instability	19
Dissipation Factor	14
Flammability Rating Test	16
Flexural Strength, Flatwise at Elevated Temperature	15
Flexural Strength, Flatwise at Room Temperature	15
Oven Blister Test	17
Peel Strength Test at Elevated Temperature	10
Peel Strength Test at Room Temperature	9
Permittivity	14
Pin Holes in Copper Surface	20
Purity of Copper	5
Scratches in Copper Surface	21
Solder Float Test	8
Solvent Resistance	7
Surface Resistivity	11
Volume Resistivity	11
Terminology	3
Thickness & Thickness Variation	18
Warp or Twist	6
Water Absorption	12

1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

Committee	D 09
DocumentType	Test Method
Pages	9
PublisherName	American Society for Testing and Materials
Status	Withdrawn
Supersedes	ASTM D 5109 : 1999 : R2004

ASTM D 1867 : 2013

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)

ASTM D 1531 : 2006	Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures (Withdrawn 2012)
ASTM D 3636 : 2000	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1825 : 1992 : R2002	Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing
ASTM D 1711 : 2002	Standard Terminology Relating to Electrical Insulation
ASTM D 1531 : 1995	Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
ASTM D 1711 : 2011	Standard Terminology Relating to Electrical Insulation
ASTM D 1867 : 2007	Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
ASTM D 3636 : 2013 : REV A : EDT 1	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1711 : 2011 : REV A	Standard Terminology Relating to Electrical Insulation
ASTM D 1711 : 2013	Standard Terminology Relating to Electrical Insulation
ASTM D 1531 : 2001	Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
ASTM D 3636 : 2006	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1867 : 2001	Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
ASTM D 1711 : 1999	Standard Terminology Relating to Electrical Insulation
ASTM D 1825 : 2003	Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)
ASTM D 3636 : 2019	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 3636 : 2013	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1531 : 2001 : EDT 1	Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
ASTM D 1711 : 2014 : REV A	Standard Terminology Relating to Electrical Insulation
ASTM D 1711 : 2015	Standard Terminology Relating to Electrical Insulation
ASTM D 1711 : 2014	Standard Terminology Relating to Electrical Insulation
ASTM D 3636 : 2013 : REV A	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1711 : 2020	Standard Terminology Relating to Electrical Insulation
ASTM D 3636 : 2011	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
ASTM D 1867 : 2013	Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
ASTM D 1711 : 2008	Standard Terminology Relating to Electrical Insulation
ASTM D 1825 : 1992 : R1997	Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing
ASTM D 1867 : 1996	Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring