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ASTM F 1709 : 1997 : R2016

Current

Current

The latest, up-to-date edition.

Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

16-05-2016

CONTAINED IN VOL. 10.04, 2016 Defines pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.1This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

Committee
F 01
DocumentType
Standard
Pages
3
ProductNote
Reconfirmed 2016
PublisherName
American Society for Testing and Materials
Status
Current
Supersedes

ASTM F 3166 : 2016 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)

ASTM E 112 : 2013 : R2021 Standard Test Methods for Determining Average Grain Size
ASTM E 112 : 2013 Standard Test Methods for Determining Average Grain Size

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