BS 4584-103.2:1990
Current
The latest, up-to-date edition.
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Hardcopy , PDF
English
28-02-1990
National foreword
Committees responsible
Specification
1. Scope
2. Designation
3. Mass per unit area, and thickness
4. Chemical analysis
5. Electrical properties
6. Tensile properties (requirements for either
lengthwise or crosswise direction)
7. Surface finish
8. Solderability
9. Surface treatment
10. Roll dimensions and tolerances
11. Packaging
Appendix
Sampling and methods of test
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