BS 6221-22:1990

Withdrawn

Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology

Available format(s)

Hardcopy , PDF

Withdrawn date

01-03-2006

Language(s)

English

Published date

31-12-1990

Publisher

British Standards Institution

Committees responsible
Foreword
Guide
1. Scope
2. General
3. Introduction to base laminate materials
4. Material specifications
5. Phenolic resin based copper-clad laminates
6. Epoxide resin based copper-clad laminates
7. Polyimide resin based copper-clad laminates
8. Polyester resin based copper-clad laminates
9. Silicone resin based copper-clad laminates
10. Polytetrafluoroethylene (PTFE) resin based copper-
    clad laminates
11. Compliant layer copper-clad laminates
12. Metallurgically bonded laminates
13. Ceramic base materials
14. Typical comparative material properties
Figures
1. Examples of a four multilayer board lay-up
2. Example of a six layer multilayer board lay-up
Tables
1. Comparative properties of phenolic resin and epoxide
    resin based materials
2. Comparative properties of polyimide resin and
    polyester resin based materials
3. Comparative properties of silicone resin and PTFE
    resin based materials
4. Comparative properties of alumina, copper-clad invar,
    copper-clad molybdenum and compliant layer materials

Guidance on the manufacture and properties of base laminate materials.

Committee	EPL/501
DevelopmentNote	Supersedes BS 6221(1982) (07/2004) Supersedes 88/31464 DC (09/2005)
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Withdrawn
Supersedes	BS 6221(1982) : LATEST

BS 4584-102.4(1990) : 1990 AMD 8244	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE
BS 6221-20:1984	Printed wiring boards Guide for the assembly of printed wiring boards
BS 6221-3:1984	Printed wiring boards Guide for the design and use of printed wiring boards
BS 4584-102.13(1990) : 1990 AMD 8421	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
BS 4584-102.12(1990) : 1990 AMD 8418	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN FABRICATION OF MULTILAYER BOARDS
BS 4584-102.2(1990) : 1990 AMD 8242	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET, ECONOMIC QUALITY
BS 6221-21:1984	Printed wiring boards Guide for the repair of printed wiring boards
BS 4584-102.3(1990) : 1990 AMD 8243	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS SPECIFICATION FOR EPOXIDE CELLULOSE PAPER COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 6221-8:1982	Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections
BS 4584-102.9(1990) : 1990 AMD 8411	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPECIFICATION FOR CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 6221-6:1982	Printed wiring boards Specification for multilayer printed wiring boards
BS 4584-102.1(1990) : 1990 AMD 8241	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY
BS 6221-5:1982	Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes
BS 4584-102.14(1990) : 1990 AMD 8422	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - PART 102 - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) ECONOMIC QUALITY
BS 4584-102.5(1990) : 1990	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 4584-102.6(1990) : 1990	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (HORIZONTAL BURNING TEST)
BS 4584-102.11(1990) : 1990 AMD 8416	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEER, GENERAL PURPOSE GRADE, FOR USE IN FABRICATION OF MULTILAYER BOARDS
BS 4584-102.10(1990) : 1990 AMD 8419	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE NON WOVEN/WOVEN GLASS REINFORCED COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 4584-102.7(1990) : 1990	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 4584-102.8(1990) : 1990 AMD 8417	METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYESTER (PETP) FILM
BS 6221-7:1982	Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections