BS CECC 23200-003:1996
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
Hardcopy , PDF
English
15-04-1996
Cooperating organizations
Foreword
1 General
2 Capability qualifying component (CQC)
3 Capability approval
4 Capability test programme
5 Additional capability
6 Traceability
Table I Capability approval test schedule
Table IIa Additional metallic conductor finishes
Table IIb Additional contact finishes
Table III Permanent organic finishes
Table IV Bonded heatsinks
Appendix A Test pattern for marking inks
Appendix B Test pattern for solder masks
Appendix C Test pattern for bonded heatsinks
Appendix D Untitled
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