SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH

Amended by

BS EN 60749-19:2003+A1:2010

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

British Standards Institution

Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary

Specifies the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term "semiconductor die" should be taken to include passive elements). It also applicable to cavity packages or as a process monitor.

Committee	EPL/47
DevelopmentNote	Supersedes 00/203597 DC (07/2003) Supersedes BS EN 60749. (09/2005) 2003 Edition Re-Issued in October 2010 & incorporates AMD 1 2010. Supersedes 09/30208058 DC. (11/2010)
DocumentType	Standard
Pages	10
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN 60749:1999 00/203597 DC : SEP 2000 09/30208058 DC : 0

Standards	Relationship
DIN EN 60749-19:2011-01	Identical
NF EN 60749-19 : 2003 AMD 1 2011	Identical
EN 60749-19:2003/A1:2010	Identical
UNE-EN 60749-19:2003	Identical
NBN EN 60749-19 : 2004 AMD 1 2010	Identical
IEC 60749-19:2003+AMD1:2010 CSV	Identical
SN EN 60749-19 : 2003	Identical
I.S. EN 60749-19:2003	Identical