SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop
        impact test method
        using test rod
Annex B (informative) - An
        example of strain
        gauge attachment
        procedure

Defines intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-95. (08/2012)
DocumentType	Standard
Pages	30
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 60749-40 : 2011	Identical
IEC 60749-40:2011	Identical

IEC 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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CEI EN 60749-40 : 2012

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory