TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 C: Chemical test methods
5 X: Miscellaneous test methods
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications

Gives a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-81. (06/2016)
DocumentType	Standard
Pages	50
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 61189-5-2:2015	Identical
EN 61189-5-2:2015	Identical

EN 61189-5 : 2006	TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
ISO 9455-2:1993	Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
ISO 9455-1:1990	Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 29455-1:1993	Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:1990)
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN ISO 9455-2:1995	Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993)

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CEI EN 61189-5-2 : 2016

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES

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