CEI EN IEC 60749-15:2021
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2021
Publisher
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.
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