DIN EN 60749-20-1:2009-10
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2009
Dieser Teil der DIN EN 60749 gilt für alle oberflächenmontierbaren Bauelemente (SMD) mit nicht hermetisch dichten Gehäusen, welche in einem Reflow-Lötverfahren beansprucht werden und die der Umgebungsatmosphäre ausgesetzt werden.
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