PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

14-07-2018

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Allgemeines
  1.1 Anwendungsbereich
  1.2 Klassifizierung
2 Normative Verweisungen
3 Durchsteck-Montagetechnik (THT)
4 Durchsteckmontage von Bauelementen
  4.1 Genauigkeit der Positionierung
  4.2 Anforderungen an Durchsteck-Bauelemente
5 Annahmeanforderungen
  5.1 Regelung und Korrekturmassnahmen
  5.2 Löten von Bauelementeanschlussdrähten für die
      Durchsteckmontage
6 Nacharbeit von unzureichenden Lötverbindungen
Anhang A (normativ) Anforderungen an die Bestückung
         mit durchsteckmontierbaren Bauelementen
Anhang ZA (normativ) Normative Verweisungen auf
          Internationale Publikationen mit ihren
          entsprechenden Europäischen Publikationen

Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)

DocumentType	Standard
Pages	0
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
EN 61191-3:2017	Identical

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DIN EN 61191-3:2018-05

PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

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