DIN EN 61967-1:2003-01

Superseded

INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS

Available format(s)

Hardcopy , PDF

Superseded date

07-03-2021

Language(s)

German

Published date

01-01-2003

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Definitions
4 Test conditions
  4.1 General
  4.2 Ambient conditions
      4.2.1 Ambient temperature
      4.2.2 Ambient RF field strength
      4.2.3 Other ambient conditions
      4.2.4 IC stability over time
5 Test equipment
  5.1 General
  5.2 Shielding
  5.3 RF measuring instrument
      5.3.1 Measuring receiver
      5.3.2 Spectrum analyser
      5.3.3 Other RBW for narrowband disturbances
      5.3.4 Disturbance type, detector type and sweep speed
      5.3.5 Video bandwidth
      5.3.6 Verification of calibration for the RF measuring
            instrument
  5.4 Frequency range
  5.5 Pre-amplifier or attenuator
  5.6 System gain
  5.7 Other components
6 Test set-up
  6.1 General
  6.2 Test circuit board
  6.3 IC pin loading
  6.4 Power supply requirements - Test board power supply
  6.5 IC specific considerations
      6.5.1 IC supply voltage
      6.5.2 IC decoupling
      6.5.3 Activity of IC
      6.5.4 Guidelines regarding IC operation
7 Test procedure
  7.1 Ambient check
  7.2 Operational check
  7.3 Specific procedures
8 Test report
  8.1 General
  8.2 Ambient
  8.3 Description of device
  8.4 Description of set-up
  8.5 Description of software
  8.6 Data presentation
      8.6.1 Graphical presentation
      8.6.2 Software for data capture
      8.6.3 Data processing
  8.7 RF emission limits
  8.8 Interpretation of results
      8.8.1 Comparison between IC(s) using the same test
            method
      8.8.2 Comparison between different test methods
      8.8.3 Correlation to module test methods
9 General basic test board specification
  9.1 Board description - mechanical
  9.2 Board description - electrical characteristics
  9.3 Ground planes
  9.4 Pins
      9.4.1 DIL packages
      9.4.2 SOP, PLCC, QFP packages
      9.4.3 PGA, BGA packages
  9.5 Via type
  9.6 Via distance
  9.7 Additional components
      9.7.1 Supply decoupling
      9.7.2 I/O load
Annex A (informative) Test method comparison
Annex B (informative) Flow chart of an example counter
                       test code
Annex C (informative) Prescription of a worst-case application
                       software description
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications
Bibliography
Figures
Tables

Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits.

DevelopmentNote	DRAFT 2017 issued in November 2017. DRAFT 2017 Corresponds equivalent to VDE 0847-21-1. (11/2017)
DocumentType	Standard
Pages	26
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Superseded

Standards	Relationship
BS EN 61967-1:2002	Identical
I.S. EN 61967-1:2002	Identical
IEC 61967-1:2002	Identical
NBN EN 61967-1 : 2003	Identical
EN 61967-1:2002	Identical
NF EN 61967-1 : 2002	Identical