Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Published date

21-05-2010

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated temperature
7 Recommended datasheet for the package warpage
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Committee	CLC/SR 47D
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
UNE-EN 60191-6-19:2010	Identical
DIN EN 60191-6-19:2010-10	Identical
NEN EN IEC 60191-6-19 : 2010	Identical
BS EN 60191-6-19:2010	Identical
PN EN 60191-6-19 : 2010	Identical
CEI EN 60191-6-19 : 2011	Identical
IEC 60191-6-19:2010	Identical
NF EN 60191-6-19 : 2010	Identical
I.S. EN 60191-6-19:2010	Identical
BS EN 61482-2:2020	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-2:2002	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)