EN ISO 9453:2020
Current
Current
The latest, up-to-date edition.
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Published date
07-10-2020
Publisher
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.An indication of the forms generally available is also included.
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