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I.S. EN 60749-30:2005

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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

Available format(s)

Hardcopy , PDF

Superseded date

29-10-2020

Language(s)

English

Published date

01-01-2005

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Summary
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	41
PublisherName	National Standards Authority of Ireland
Status	Superseded
SupersededBy	I.S. EN IEC 60749-30:2020

Standards	Relationship
IEC 60749-30:2005+AMD1:2011 CSV	Identical
BS EN 60749-30 : 2005	Identical
NF EN 60749-30 : 2005 AMD 1 2011	Identical
DIN EN 60749-30:2011-12	Identical
UNE-EN 60749-30:2005	Identical
EN 60749-30 : 2005 AMD 1 2011	Identical
NBN EN 60749-30 : 2006 AMD 1 2011	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-24:2004	Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-11:2002	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
EN 60749-11:2002	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-33:2004	Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC 60749-24:2004	Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
EN 60749-33:2004	Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

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I.S. EN 60749-30:2005

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

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Abstract

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