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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

Publisher

National Standards Authority of Ireland

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop impact test method
        using test rod
Annex B (informative) - An example of strain gauge
        attachment procedure
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	28
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 60749-40 : 2011	Identical
IEC 60749-40:2011	Identical

IEC 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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I.S. EN 60749-40:2011

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

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Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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