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I.S. EN 61190-1-3:2007

I.S. EN 61190-1-3:2007

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

Available format(s)

Hardcopy , PDF

Withdrawn date

17-01-2021

Language(s)

English

Published date

01-01-2007

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
  4.1 Alloy composition
  4.2 Solder form
  4.3 Flux type
  4.4 Flux percentage and metal content
  4.5 Other characteristics
5 Requirements
  5.1 Materials
  5.2 Alloys
  5.3 Solder forms
  5.4 Flux type and form
  5.5 Flux residue dryness
  5.6 Spitting
  5.7 Solder pool
  5.8 Labelling for product identification
  5.9 Workmanship
6 Quality assurance provisions
  6.1 Responsibility for inspection and compliance
  6.2 Classification of inspections
  6.3 Materials inspection
  6.4 Qualification inspections
  6.5 Quality conformance
  6.6 Preparation of solder alloy for test
7 Preparation for delivery - Preservation, packing and
  packaging
Annex A (informative) Selection of various alloys and
        fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) Lead-free solder alloys tests
Annex C (informative) Marking method of solder designation
        for mounted board, used in electronic equipment
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications and for 'special' electronic grade solders.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
53
PublisherName
National Standards Authority of Ireland
Status
Withdrawn

EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 29454-1:1993 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
ISO 9001:2015 Quality management systems — Requirements
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

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