Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Amended by

IEC 60191-4:2013/AMD1:2018

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

27-03-2018

Publisher

International Electrotechnical Committee

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.

DocumentType	Standard
Pages	152
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60191-4:1999/AMD2:2002 IEC 60191-4:1999 IEC 60191-4:1999/AMD1:2001 IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV