IEC 60249-2-11:1987

Withdrawn

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Amended by

IEC 60249-2-11:1987/AMD2:1993

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

23-07-2013

Published date

15-05-1987

Publisher

International Electrotechnical Committee

FOREWORD
PREFACE
Clause
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing

Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in).The sheet consists of an insulating base (epoxide resin bonded woven glass fabric laminate) with metal foil bonded to one or both sides.

Committee	TC 91
DevelopmentNote	Also numbered as BS EN 60249-2.11 (06/2001)
DocumentType	Standard
Pages	42
PublisherName	International Electrotechnical Committee
Status	Withdrawn

Standards	Relationship
UNE-EN 60249-2-11:1996	Identical
HD 313.2.11 : 200S2	Identical
NEN EN IEC 60249-2-11 : 1994 AMD 4 2001	Identical
NEN 10249-2-11 : 1994 AMD 3 1996	Identical
I.S. EN 60249-2-11:1995	Identical
PN EN 60249-2-11 : 2002	Identical
SN EN 60249-2-11 : 1994 AMD 4 2000	Identical
CEI 52-16 : 1ED 1990	Identical
EN 60249-2-11 : 1994 AMD 4 2000	Identical
NF EN 60249 2-11 : 96 AMD 4 2001	Identical
DIN EN 60249-2-11:2001-09	Identical
DIN IEC 60249-2-11 : 1992	Identical
UNE 20620-2-11:1993	Identical
BS 4584-102.11(1990) : 1990 AMD 8416	Identical

BS 123700-003:2001	System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
BS 123600-003:2001	System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
BS 123300-003:2001	System of quality assessment. Capability detail specification. Rigid multilayer printed boards

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IEC 60249-2-11:1987

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Category

Subcategory