IEC TS 62647-22:2013
Current
The latest, up-to-date edition.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
25-09-2013
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Approach
5 General Pb-free solder alloy behavior
6 System level service environment
7 High performance electronics testing
8 Solder joint reliability considerations
9 Piece parts
10 Printed circuit boards
11 Printed circuit board (PCB)/printed wiring board
(PWB) assembly
12 Module assembly considerations
13 Manufacturing resources
14 Aerospace wiring/cabling considerations
15 Rework/repair
16 Generic life testing
17 Similarity analysis
Annex A (informative) - Equipment service environmental
definition
Bibliography
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.