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IEC TS 62878-2-3:2015

Current

Current

The latest, up-to-date edition.

Device embedded substrate - Part 2-3: Guidelines - Design guide

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

27-03-2015

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

DevelopmentNote
Stability date: 2018. (03/2015)
DocumentType
Technical Specification
Pages
50
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
PD IEC/TS 62878-2-3:2015 Identical
NEN NPR IEC/TS 62878-2-3 : 2015 Identical

PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
PD IEC/TS 62878-2-4:2015 Device embedded substrate Guidelines. Test element groups (TEG)
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC 62421:2007 Electronics assembly technology - Electronic modules
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions

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