TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING

Available format(s)

Hardcopy

Language(s)

English

Published date

14-12-2010

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 TEST METHODS
4 REFERENCES

Specifies test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads.

DevelopmentNote	Included in IPC C 103 & IPC C 1000. (12/2010) Also available in Chinese language, See IPC 9708 CHINESE. (07/2013)
DocumentType	Standard
Pages	17
PublisherName	Institute of Printed Circuits
Status	Current

IPC 9704 CHINESE : -	PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 9704 : A	PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 6011 : 0	GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS

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IPC 9708 : 0

TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING

Table of Contents

Abstract

General Product Information

Standards Referenced By This Book

Standards Referencing This Book

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