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IPC CI 408 : 0

Current

Current

The latest, up-to-date edition.

DESIGN AND APPLICATION GUIDELINES FOR THE USE OF SOLDERLESS SURFACE MOUNT CONNECTORS

Available format(s)

Hardcopy

Language(s)

English

Published date

01-01-1994

1 INTRODUCTION
  1.1 Scope
  1.2 Purpose
  1.3 Terms, Definitions and Acronyms
  1.4 Applicable Documents
2 TECHNOLOGIES SUMMARIZED
  2.1 Conductive Adhesives
  2.2 Elastomerics - Metal on Elastomer Type
  2.3 Layered Elastomeric Elements
  2.4 Elastomeric Conductive Polymer Interconnection
      (ECPI)
  2.5 Pressure Clip Interconnections
  2.6 Button Board
3 TECHNOLOGIES EXPANDED
  3.1 Conductive Adhesives
  3.2 Elastomerics - Metal on Elastomer Type
  3.3 Layered Elastomeric Elements
  3.4 Elastomeric Conductive Polymer Interconnection (ECPI)
  3.5 Pressure Clip Interconnection
  3.6 Button Board
Figures
Tables

Covers design characteristics and the application of solderless surface mount connectors, including conductive adhesives in order to aid the designer in effectively interconnecting his package.

DocumentType
Standard
Pages
137
PublisherName
Institute of Printed Circuits
Status
Current

IPC C 406 : 0 DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS

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IPC C 406 : 0 DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS

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