IPC FC 231 : C1992 AMD 1 1995

Name: IPC FC 231 : C1992 AMD 1 1995
Brand: IPC

Superseded

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FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING

Superseded date

01-05-2002

Published date

12-01-2013

Publisher

Institute of Printed Circuits

NO CONTENTS SECTION

Establishes the requirements for flexible base dielectric materials to be used in the fabrication of flexible printed wiring and flexible flat cable. The following topics are covered: base dielectrics; type of reinforcement; method of reinforcement and product classification.

DevelopmentNote	D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 4202 : A
Supersedes	IPC FC FLX : 1988

IPC A 31 : LATEST	FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT
MIL-STD-2118 Base Document:1984	FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IEC PAS 62293:2001	Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards

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IPC FC 231 : C1992 AMD 1 1995

FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING

Table of Contents

Abstract

General Product Information

Standards Referenced By This Book

Category

Subcategory