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IPC-J-STD-003D:2023

IPC-J-STD-003D:2023

Current

Current

The latest, up-to-date edition.

Solderability Tests for Printed Boards

Available format(s)

Hardcopy

Language(s)

Chinese

Published date

01-01-2023

Publisher

Institute of Printed Circuits

The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered.

DocumentType
Standard
Pages
44
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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Hardcopy - Chinese
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