IPC J STD 027 : 0
Current
The latest, up-to-date edition.
MECHANICAL OUTLINE STANDARD FOR FLIP CHIP AND CHIP SIZE CONFIGURATIONS
01-02-2003
1. SCOPE
1.1 Purpose
1.2 Intent
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Recommended Mechanical Outline for Flip Chip Dice and
Chip Size Packages
3.1.1 Flip Chip Devices
3.1.2 Chip Size Packages
3.1.3 I/O Capability
3.2 Interconnection Bump/Contact Attributes
3.2.1 Functional Types
3.2.2 Ball/Bump/Land Sizes
3.2.3 Ball/Bump/Land Patterns
3.2.4 I/O Drivers on the Periphery
3.2.5 Isolating Sensitive I/Os
3.2.6 Ball/Bump/Land Height Uniformity and Coplanarity
Annex A NORMATIVE TERMINOLOGY
Annex B ACRONYMS
Figures
Tables
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