Fixed capacitors for use in electronic equipment -- Part 1: Generic specification

Available format(s)

Hardcopy

Language(s)

Japanese

Published date

20-11-2023

Publisher

Japanese Standards Association

DocumentType	Revision
Pages	94
PublisherName	Japanese Standards Association
Status	Current
Supersedes	JIS C 5101-1:2019

Standards	Relationship
IEC 60384-1:2021	Identical

JIS C 60068-2-14:2011	Environmental testing Part 2-14: Tests - Test N: Change of temperature
JIS C 60068-2-45:1995	Environmental testing procedures of electronic and electrical resistance to solvents (immersion in cleaning solvents)
JIS C 60068-2-69:2019	Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
JIS C 60068-2-27:2011	Environmental testing -- Part 2-27: Tests -- Test Ea: Shock
JIS C 60068-2-30:2011	Environmental testing -- Part 2-30: Tests -- Test Db: Damp heat, cyclic (12 h + 12 h cycle)
JIS C 60068-2-6:2010	Environmental testing Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
JIS C 60068-1:2016	Environmental Testing - Part 1: General And Guidance
JIS C 60068-2-21:2023	Environmental testing -- Part 2-21: Tests -- Test U: Robustness of terminations and integral mounting devices
JIS C 60068-2-2:2010	Environmental testing -- Part 2-2 : Tests -- Test B: Dry heat Part 2-2 : Tests - Test B: Dry heat
JIS C 60068-2-78:2015	Environmental Testing - Part 2-78: Tests - Test Cab: Damp Heat, Steady State
JIS C 60068-2-67:2001	Environmental testing -- Part 2: Tests -- Test Cy: Damp heat, steady state, accelerated test primarily intended for components Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
JIS C 60068-2-20:2022	Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads
JIS C 60068-2-82:2021	Environmental testing -- Part 2-82: Tests -- Test Xw1: Whisker test methods for components and parts used in electronic assemblies
JIS C 60068-2-13:2023	Environmental testing -- Part 2-13: Tests -- Test M: Low air pressure
JIS C 60068-2-58:2016	Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
JIS C 60068-2-1:2010	Environmental testing Part 2-1: Tests - Test A: Cold
JIS Z 8601:1954	Preferred numbers
JIS C 60068-2-17:2001	Basic environmental testing procedures -- Part 2: Tests -- Test Q: Sealing Part 2: Tests - Test Q: Sealing