Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

30-04-1995

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the copper-clad laminates to be used for flexible printed wiring boards (employing, polyester film or polyimide film as the base) (hereafter referred to as "copper-clad laminates").

DocumentType	Standard
Pages	15
PublisherName	Japanese Standards Association
Status	Current

Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990

JIS C 6471:1995	Test methods of copper-clad laminates for flexible printed wiring boards
JIS C 6512:1992	Electrodeposited Copper Foil For Printed Wiring Boards
JIS C 6480:1994	General rules of copper-clad laminates for printed wiring boards

JIS E 5006:2005

Electronic Equipment For Rolling Stock

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JIS C 6472:1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

Table of Contents

Abstract

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Standards Referencing This Book

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