NBN EN 60191-6 : 2010
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
12-01-2013
1 Scope
2 Normative references
3 Definitions
4 Design rules
5 Dimensions to be specified
6 Notes
Annex A (informative) Illustration of the rules
A.1 Gull-wing lead package with two parallel rows of
terminals (SOP,TSOP Type 2)
A.2 Gull-wing lead package with two parallel rows of
terminals (TSOP Type 1)
A.3 Gull-wing lead package with one row of terminals
on each of four sides (QFP)
A.4 J-bent lead package with two parallel rows of
terminals (SOJ)
A.5 Folded lead package with one row of terminals on
each of four sides (QFJ)
A.6 Leadless package
A.7-1 Ball grid array package (BGA) Type 1
A.7-2 Ball grid array package (BGA) Type 2
Annex B (informative) Optional table format
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Figures
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