MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

Published date

12-01-2013

Publisher

1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications

Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

DevelopmentNote	Indice de classement: C96-013-6-1PR. PR NF EN 60191 6-1 March 2002. (09/2002) PR NF EN 60191-6-1 September 2011. (09/2011)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
BS EN 60191-6-1:2001	Identical
IEC 60191-6-1:2001	Identical
UNE-EN 60191-6-1:2002	Identical
EN 60191-6-1:2001	Identical
DIN EN 60191-6-1:2002-08	Identical
I.S. EN 60191-6-1:2002	Identical

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NF EN 60191-6-1 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

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Abstract

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