NF EN IEC 61190-1-3:2018
Current
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Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-03-2018
Publisher
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
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