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OVE/ONORM EN 61760-2 : 2007

OVE/ONORM EN 61760-2 : 2007

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE

Superseded date

13-10-2022

Published date

12-01-2013

Publisher

Osterreichisches Normungsinstitut/Austrian Standards

Diese ÖVE/ÖNORM EN beschreibt die Transport- und Lagerungsbedingungen für oberflächenmontierbare Bauelemente (SMD), die zu erfüllen sind, um eine störungsfreie Verarbeitung der oberflächenmontierbaren Bauelemente, aktive wie auch passive, sicherzustellen. (Bedingungen für Leiterplatten werden nicht berücksichtigt.) Der Zweck dieser Internationalen Norm ist, sicherzustellen, dass Anwender von SMD Produkte erhalten und lagern, die ohne Beeinträchtigung von Qualität und Zuverlässigkeit weiterverarbeitet (z. B. positioniert, gelötet) werden können. Dabei können unsachgemässer Transport und Lagerung von SMD Verschlechterungen hervorrufen und zu Problemen bei der Bestückung wie schlechter Lötbarkeit, Delaminierung und Popcorneffekten führen.

DevelopmentNote
Supersedes ONORM OVE EN 61760-2. (05/2010)
DocumentType
Standard
PublisherName
Osterreichisches Normungsinstitut/Austrian Standards
Status
Superseded
SupersededBy

Standards Relationship
EN 61760-2:2007 Identical
IEC 61760-2:2007 Identical

EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
EN 60721-3-1:1997 Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 1: Storage
EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 60721-3-2:1997 Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation
EN 61340-5-2:2001/corrigendum:2001 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60721-3-2:1997 Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage

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