SEMI 3D12 : 2015

Name: SEMI 3D12 : 2015
Brand: SEMI

Superseded

GUIDE FOR MEASURING FLATNESS AND SHAPE OF LOW STIFFNESS WAFERS

Superseded date

08-02-2021

Published date

11-05-2015

Publisher

Semiconductor Equipment & Materials Institute

Gives definitions for describing a more suitable measurement strategy for low stiffness wafers and geometries.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (05/2015)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Superseded
SupersededBy	SEMI 3D12:2020

SEMI 3D16 : 2016	SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI 3D2 : 2016	SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
SEMI 3D4 : 2015	GUIDE FOR METROLOGY FOR MEASURING THICKNESS, TOTAL THICKNESS VARIATION (TTV), BOW, WARP/SORI, AND FLATNESS OF BONDED WAFER STACKS

SEMI MF533 : 2010(R2016)	TEST METHODS FOR THICKNESS AND THICKNESS VARIATION OF SILICON WAFERS
SEMI M59 : 2014	TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI MF1530 : 2007(R2018)	TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI MF534 : 2007	TEST METHOD FOR BOW OF SILICON WAFERS
SEMI MF1451:2007(R2019)	TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI MF657 : 2007E	TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTRAST SCANNING

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