Name: SEMI E137 : 2005(R2018)E
Brand: SEMI

GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Provides guidelines for activities specific to the final assembly and packaging at the supplier's facility, transportation, and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer's cleanroom manufacturing area.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. Supersedes SEMI E49.1. (10/2004) E = This standard was editorially modified in January 2018 to correct editorial errors. (01/2018)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

SEMI F63 : 2016	GUIDE FOR ULTRAPURE WATER USED IN SEMICONDUCTOR PROCESSING
SEMI C41 : 2005	SPECIFICATIONS AND GUIDELINES FOR 2-PROPANOL
SEMI E49.2 : 2017	GUIDE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED IN ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR PROCESS EQUIPMENT

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SEMI E137 : 2005(R2018)E

GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

Abstract

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