SN EN 60738-1 : 2006

1 General
1.1 Scope
1.2 Normative references
2 Technical data
2.1 Units and symbols
2.2 Definitions
2.3 Preferred values
2.4 Marking
3 Quality assessment procedures
3.1 General
3.2 Primary stage of manufacture
3.3 Subcontracting
3.4 Structurally similar components
3.5 Qualification approval procedures
3.6 Rework and repair
3.7 Release for delivery
3.8 Certified test records of released lots
3.9 Delayed delivery
3.10 Alternative test methods
3.11 Manufacture outside the geographical limits of IECQ NSIs
3.12 Unchecked parameters
4 Test and measurement procedures
4.1 General
4.2 Standard conditions for testing
4.3 Drying and recovery
4.4 Visual examination and check of dimensions
4.5 Zero-power resistance
4.6 Temperature coefficient of resistance
4.7 Insulation resistance (for insulated types only)
4.8 Voltage proof (for insulated types only)
4.9 Resistance/temperature characteristic
4.10 Dissipation factor at Umax.
4.11 Response time by ambient temperature change
4.12 Response time by power change
4.13 Thermal time constant by ambient temperature change
4.14 Thermal time constant by cooling
4.15 Robustness of terminations
4.16 Soldering
4.17 Rapid change of temperature
4.18 Vibration
4.19 Bump
4.20 Shock
4.21 Climatic sequence
4.22 Damp heat, steady state
4.23 Endurance
4.24 Tripping current and tripping time
4.25 Non-tripping current
4.26 Residual current
4.27 Surface temperature
4.28 Inrush current
4.29 Mounting (for surface mount thermistors only)
4.30 Shear (adhesion) test
4.31 Substrate bending test
Annex A (normative) Interpretation of sampling plans and procedures
        as described in IEC 60410 for use within the IEC quality
        assessment system for electronic components (IECQ)
Annex B (informative) Mounting for electrical measurements (except surface
        mount types)
Annex C (informative) Mounting for temperature measurements
Annex ZA Normative references to international publications with
         their corresponding European publications