09/30190356 DC : 0

Superseded

View Superseded by

BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

Available format(s)

Hardcopy , PDF

Superseded date

30-09-2011

Language(s)

English

Publisher

British Standards Institution

1 Scope and object
2 Normative references
3 Terms and definitions
4 Test method and equipment
5 Test procedure
6 Test method
7 Summary
Annex A (Normative) - Drop impact test equipment
by using test rod
Annex B (Informative) - An example of strain gauge
attachment procedure

BS EN 60749-40

Committee	EPL/47
DocumentType	Draft
Pages	24
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 60749-40:2011

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-20-1:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat