BS 9761:1988

Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base materials
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for multilayer boards
     with PTHs
B Locations of specimens on CTP for multilayer boards
C Layout of composite V layers
D Layout of specimens A, B and G
E Layout of specimen C
F Layout of specimens D and E
G Layout of specimens F and K
H Layout of specimens L and N
J Layout of specimen J
K Layout of specimens M and H
L CTPs for multilayer boards, including hole sizes
M CTP layout
N Construction of multilayer CTPs for capability
     approval
P Example of format for abstract of description of
     capability for inclusion in PD 9002
Q Format for customer detail specification for rigid
     printed wiring boards with PTHs complying with
     BS 9761
Tables
1 Allocation of CTP specimens
2 Schedule of tests for capability approval for
     multilayer boards with PTHs
3 Quality conformance inspection: multilayer printed
     wiring boards with PTHs
4 CTP hole sizes
Figures
1 Examples of acceptable and non-acceptable soldered
     holes
2 CTP for multilayer boards with PTHs
3 CTP layout
4 Example of eight-layer construction
5 Example of twelve-layer construction