Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-08-2011

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Gives standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: \'Rectangular type\' has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.

Committee	EPL/47
DevelopmentNote	Supersedes 02/204115 DC (10/2002) Supersedes 10/30215537 DC. (08/2011)
DocumentType	Standard
Pages	24
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN 60191-6-12:2002 02/204115 DC : DRAFT APR 2002 10/30215537 DC : 0

Standards	Relationship
EN 60191-6-12:2011	Identical
NF EN 60191-6-12 : 2012	Identical
IEC 60191-6-12:2011	Identical
DIN EN 60191-6-12:2011-12	Identical
UNE-EN 60191-6-12:2004	Identical
I.S. EN 60191-6-12:2011	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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BS EN 60191-6-12:2011

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

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