BS EN 60269-4:2009+A2:2016

These supplementary requirements apply to fuse-links for application in equipment containing semiconductor devices for circuits of nominal voltages up to 1000V a.c. or 1500V d.c. and also, in so far as they are applicable, for circuits of higher nominal voltages. NOTE1 Such fuse-Iinks are commonly referred to as “semiconductor fuse-links??. NOTE2 In most cases, a part of the associated equipment serves the purpose of a fuse-base. Owing to the great variety of equipment, no general rules can be given; the suitability of the associated equipment to serve as a fuse-base should be subject to agreement between the manufacturer and the user. However, if separate fuse-bases or fuse-holders are used, they should comply with the appropriate requirements of IEC60269‑1 . NOTE3 IEC60269‑6 (Low-voltage fuses– Part6: Supplementary requirements for fuse-links for the protection of solar photovoltaic energy systems) is dedicated to the protection of solar photovoltaic energy systems. NOTE4 These fuse-links are intended for use on systems employing the standardized voltages and tolerances of IEC60038 . Tests carried out on fuse-links in accordance with previous editions of this standard shall remain valid until such time as complimentary equipment has evolved to the standardized voltages and tolerances of IEC60038 . The object of these supplementary requirements is to establish the characteristics of semiconductor fuse-links in such a way that they can be replaced by other fuse-links having the same characteristics, provided that their dimensions are identical. For this purpose, this standard refers in particular to the following characteristics of fuses: their rated values; their temperature rises in normal service; their power dissipation; their time-current characteristics; their breaking capacity; their cut-off current characteristics and their I 2 t characteristics; their arc voltage characteristics; type tests for verification of the characteristics of fuses; the markings on fuses; availability and presentation of technical data (see AnnexBB).