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BSI
BS EN 61188-5-5:2007

BS EN 61188-5-5:2007

Current

Current

The latest, up-to-date edition.

Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides

Published date

31-12-2007

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 PQFP (square)
  4.1 Field of application
  4.2 Component descriptions
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 PQFP (rectangular)
  5.1 Field of application
  5.2 Component descriptions
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 PLQFP (square)
  6.1 Field of application
  6.2 Component descriptions
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 PLQFP (rectangular)
  7.1 Field of application
  7.2 Component descriptions
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
8 PTQFP (square)
  8.1 Field of application
  8.2 Component descriptions
  8.3 Component dimensions
  8.4 Solder joint fillet design
  8.5 Land pattern dimensions
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.

IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Committee
EPL/501
DevelopmentNote
Supersedes 95/208509 DC. (01/2008)
DocumentType
Standard
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 61188-5-5:2007 Identical
I.S. EN 61188-5-5:2007 Identical
NF EN 61188-5-5 : 2016 Identical
EN 61188-5-5:2007 Identical
DIN EN 61188-5-5:2008-07 Identical

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

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