Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2011

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
        electrostatic device with an integrated actuation
        component and displacement detection component
Annex B (informative) - Example of testing using an external
        drive and a device with an integrated strain gauge
        for detecting displacement
Annex C (informative) - Example of electromagnetic drive
        out-of-plane vibration test (external drive
        vibration test)
Annex D (informative) - Theoretical expression on fatigue
        life of brittle materials based on Paris' law
        and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Describes a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.

This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 µm to 1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness.

The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

Committee	EPL/47
DevelopmentNote	Supersedes 10/30205425 DC. (11/2011)
DocumentType	Standard
Pages	34
PublisherName	British Standards Institution
Status	Current
Supersedes	10/30205425 DC : 0

Standards	Relationship
EN 62047-12 : 2011	Identical
IEC 62047-12:2011	Identical

IEC 62047-2:2006	Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006	Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
ISO 12107:2012	Metallic materials — Fatigue testing — Statistical planning and analysis of data

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BS EN 62047-12:2011

Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

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