Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-08-1997

Publisher

British Standards Institution

INTRODUCTION
1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities of requirements
to those specified in the generic and/or
sectional specification
8 Inspection requirements (see tables 2 and 3 or 4 and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests

Committee	EH/4
DevelopmentNote	Supersedes BS QC760201(1992) and 95/200683 DC. Also numbered as IEC 60748-22-1. To be read in conjunction with BS QC 760000(1990) and BS QC 760200(1997) (09/2003)
DocumentType	Standard
Pages	20
PublisherName	British Standards Institution
Status	Current
Supersedes	BS QC 760201:1992

BS QC 760000:1990	Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification
IEC 60748-22:1997	Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
IEC 60748-20-1:1994	Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
BS QC 760200:1992	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval