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CEI EN 60191-6-16 : 2008

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2008

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-60. (03/2008)
DocumentType
Standard
Pages
18
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60191-6-16:2007 Identical
IEC 60191-6-16:2007 Identical

IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

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