CEI EN 60191-6-18 : 2011
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
Hardcopy , PDF
English
01-01-2011
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Terminal position numbering
5. Nominal package dimension
6. Symbols and drawings
7. Dimensions
8. Recommended BGA variations
Bibliography
Annex ZA(normative) - Normative references to
international publications with their
corresponding European publications
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