CEI EN 60191-6-4 : 2004
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2004
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
5 Measuring method
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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