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CEI EN 60749-35 : 2012

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
4 Procedure
Annex A (informative) - Acoustic
        microscopy check sheet
Annex B (informative) - Potential
        image pitfalls
Annex C (informative) - Some
        limitations of acoustic
        microscopy
Annex D (informative) - Reference
        checklist for presenting
        applicable scanned data
Bibliography

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-87. (03/2012)
DocumentType
Standard
Pages
28
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60749-35:2006 Identical
IEC 60749-35:2006 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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