SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography

Describes the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-19 (04/2004) Supersedes CEI EN 60749. (05/2008) 1ED 2004 Edition is valid until 07-04-2020. (11/2017)
DocumentType	Standard
Pages	12
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749 : 2000 AMD 2 2004

Standards	Relationship
EN 60749-9:2017	Identical
IEC 60749-9:2017	Identical

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CEI EN 60749-9 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING

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Abstract

General Product Information

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