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CEI EN 62435-5 : 1ED 2017

Current

Current

The latest, up-to-date edition.

ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES

Published date

10-10-2017

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Storage requirements
5 Long-term storage failure mechanisms
6 LTS concerns, method, verification and limitations
7 Deterioration mechanisms specific to bare die and wafers
8 Specific handling concerns
Annex A (informative) - Audit checklist
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-143. (10/2017)
DocumentType
Standard
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62435-5:2017 Identical
IEC 62435-5:2017 Identical

EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

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