CEI EN IEC 61760-3:2021
Current
Current
The latest, up-to-date edition.
Surface mounting technology Part 3: Standard method for the specification of components for throughhole reflow (THR) soldering
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-10-2021
Publisher
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
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