MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2002

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.

DevelopmentNote	Supersedes DIN IEC 47D-195-CD. (05/2002)
DocumentType	Standard
Pages	12
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
UNE-EN 60191-6-5:2002	Identical
BS EN 60191-6-5:2001	Identical
EN 60191-6-5:2001	Identical
I.S. EN 60191-6-5:2002	Identical
NF EN 60191-6-5 : 2002	Identical
IEC 60191-6-5:2001	Identical